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Spin Coater JS401           catalogs  JS401-150     JS401-200     JS401-300

 

      »ç¿ëÀÚ¿¡°Ô Ä£¼÷ÇÑ µðÁöÅÐ ¹æ½ÄÀÇ ÇÁ·Î±×·¥À¸·Î ¼±ÅÃÀû photoresist, EBR, HMDS ¶Ç´Â BSRÀ» ¼±ÅÃÀûÀ¸·Î »ç¿ëÇÒ ¼ö ÀÖ´Â µð½ºÆæ½Ì ¼ÒÇÁÆ®¿þ¾î¸¦ Á¦°øÇÕ´Ï´Ù. »ç¿ëÇϱâ Æí¸®ÇÏ°í, ¼ÒÇüÀ̸ç, °ß°íÇÑ bench top ŸÀÔÀÇ JS401 spin coater systemÀº °í¼º´ÉÀÌ ÇÊ¿äÇÑ °í°´¿¡°Ô °æÀï·Â ÀÖ´Â °¡°ÝÀ¸·Î Á¦°øµË´Ï´Ù.

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  • Spin Speed Repeatability: < 0.05 %
  • Spin Speed Resolution: < 0.05%                                                              
  • Substrate Sizes (<1 cm - 300 mm round / 220 by 220 square)
  • ÄÚÅÍ

    ¸ð     ÇÁ·Î±×·¥ ¹× Hardwareµ¨ JS401Àº À缺¿£Áö´Ï¾î¸µÀÇ ±âº»ÀÌ µÇ´Â Á¦Ç°À¸·Î½á, 200

 

 

Reliability

  • All stainless polished 304 construction
  • Drain a port located in the bottom of the bowl
  • Optional Nitrogen purge for inert spin environment
  • ±âº»Àû ÀÚµ¿ ÅäÃâÀåÄ¡¸¦ 4°³ ±îÁö È®Àå °¡´É (PR, EBR, HMDS, BSR or develop)
  • 1 ³â°£ Ç°Áú º¸Áõ ( ºÎÇ° ¹× ÀηÂ)
  • °í°´¿¡ ´ëÇÑ ¹«Á¦ÇÑ application Á¦°ø

 

  • LCD touch screen
  • 20 process programs
  • 20 steps per program (Upgradeable with software option)
  • 0.1 second resolution for step times
  • Acceleration and deceleration settable by 0.1 second resolution(programmable ramp)
  • Spin speed 0 - 6,000 rpm (10,000 rpm option)
  • Spin speed acceleration:
    • 0 - 30,000 rpm/sec unloaded
    • 0 - 23,000 rpm/sec with 100 mm SI wafer
  • Programmable logic controller (PLC) system controller
  • Max. wafer: 4"(JS401-100), 6"(JS401-150), 8"(JS401-200), 12"(JS401-300)
  • Optional manual PR dispenser, EBR and developer
  • Optional manual wafer alignment tool
  • Standard simultaneous dispense capability expanded upto 4 units(w/ pressure tanks)

      -- Photoresist, EBR, HMDS, BSR or Developing

      
  • Security: Vacuum chuck interlock
  • Optional floor type: HEPA filter, Auto damper for exhaust and wafer loading aligned
  • Optional auto dispensing unit available with swing nozzles

 

 

 

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